Date : 2012/10/15, Hit : 916
Á¦¸ñ    [¼¼¹Ì³ª] Ultrashort pulse laser materials processing – Status and perspectives
ÀÛ¼ºÀÚ   S.H.Cho
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±¤ÀÀ¿ë±â°è¿¬±¸½Ç¿¡¼­´Â µ¶ÀÏ Jena ÀÇ Friedrich-Schiller ´ëÇÐ Institute of Applied Physics ÀÇ Ultrafast optics group À» À̲ø°í ÀÖ´Â Stefan Nolte ±³¼ö¸¦ ¸ð½Ã°í ±ØÃÊ´Ü ÆÞ½º ·¹ÀÌÀú ¹Ì¼¼ °¡°øÀÇ ÇöȲ°ú Àü¸Á ¹× µ¶ÀÏ ³»ÀÇ ±ØÃÊ´Ü ÆÞ½º ·¹ÀÌÀú °³¹ß ¹× °¡°ø ¿¬±¸ activities¸¦ ¼Ò°³ÇÏ´Â ÃÊû °­¿¬À» °³ÃÖÇÕ´Ï´Ù. ·¹ÀÌÀú¸¦ ÀÌ¿ëÇÑ ¹Ì¼¼ °¡°ø¿¡ °ü½É ÀÖÀ¸½Å ºÐµéÀÇ Âü¼®À» ºÎʵ右´Ï´Ù.


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- ¼¼¹Ì³ª Á¦¸ñ: Ultrashort pulse laser materials processing – Status and perspectives
- ¿¬»ç: Prof. Dr. Stefan Nolte (Friedrich-Schiller-University Jena)

- ÃÊ·Ï: Ultrashort pulses have attracted great interest for the fabrication of precise microstructures, since thermal and mechanical damage can be minimized [1]. This is not only restricted to metals; interesting applications can also be found for the volume processing of transparent materials [2]. However, for a broad industrial use the processing speed has to be increased significantly. Novel ultrafast laser systems promise to provide sufficient power for such an increase, however for the scaling of the process speed a detailed understanding of the laser ablation process at these conditions is required, too [3].
In this presentation the fundamentals of the interaction process are discussed. This provides the basis for investigations on scaling the processing speed by increasing the laser repetition rate and average power [4]. Specifically the investigation of ultrashort pulse laser deep drilling will be discussed. Here, the drilling progress is directly visualized by using crystalline silicon as target material [5].
Additionally, an overview on current research activities in Germany with respect to ultrashort pulse micromachining including laser development will be given.

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